Nextreme Thermal Solutions (Durham, NC) has announced a new series of thin-film thermoelectric modules that offer higher cooling capacity, robust mechanical design, and source-matched heat flux density for easier integration into existing electronic systems. At only 1.1 mm high, the new eTEC MA8000 Series is designed to provide low-profile thermal management solutions for medium heat flux applications in markets including photonics, electronics, test and measurement, and aerospace. Features include:
- 5 new modules that can pump from 10 to over 80 W of heat @ an ambient temperature of 25°C.
- A footprint ranging from 63 to 375 mm².
- Heat flux densities ranging from 16 to 22 W/cm².
- A high-strength seal ring made from Cirlex polyimide film that provides mechanical isolation across the thermoelectric device.