Advertisement

Sarcon 30XR-m from Fujipoly is a high-performance thermal interface material that exhibits a low thermal resistance. The 0.3mm thick TIM is available in dimensional sheets up to 200mm × 150mm or can be die-cut to fit your exact application shape.  

When placed between a heat source such as a semiconductor and a nearby heat sink, Sarcon 30XR-m provides a thermal conductivity of 17.0 W/m•K and a thermal resistance of only 0.30° C•in2/W.  

The silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This increases surface contact with the heatsink, thereby improving overall cooling performance.

For more information visit www.fujipoly.com

Advertisement
Advertisement