The HPL features a thermal performance of 0.30°C/W.
Bergquist (Chanhassen, MN) introduces a new high thermal performance dielectric into its comprehensive Thermal Clad metal core PCB line. HPL is a dielectric specifically formulated for high power lighting LED applications with demanding thermal performance requirements. This thin dielectric at 0.0015" (38μm) has an ability to withstand high temperatures with a glass transition of 185°C. Additional features include:
- A thermal performance of 0.30°C/W (RD 2018).
- High thermal conductivity of 3.0 W/m-K.
- High temperature applications.
- Lead-free solder compatible.
- RoHS compliant and environmentally green.
- Available in all aluminum and copper metal substrates as well as Ultra Thin Circuits.
For more information visit www.bergquistcompany.com
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