Product Design & Development

VIA Technologies’ Fanless & Ruggedized Embedded Box System

By VIA Technologies
Monday, March 15, 2010

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The VIA ART-3000 features diskless booting, excellent vibration and shock resistance.



VIA Technologies, Inc, (Taipei, Taiwan) has announced the VIA ART-3000, a complete, fanless and ruggedized embedded box system based on the unique I/O-rich Em-ITX form factor, offering the ideal solution for a variety of industrial applications. Features include:

  • Diskless booting, excellent vibration and shock resistance.
  • Dual Gigabit networking and dual LVDS video support.
  • No moving parts.
  • Supports up to 3 displays and 2 independent video content streams, across dual LVDS and VGA ports.
  • A temperature range of -20° to - 60°C.
  • Supports vibrations of up to 5Gs and shock resistance up to 20Gs in compact flash storage configurations.

For more in formation visit www.via.com.tw

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