Sarcon GR-Sd is engineered to efficiently transfer heat from its source to a nearby heat sink in applications that require extremely low force.

Fujipoly (Carteret, NJ) announces the availability of Sarcon GR-Sd, one of the industry's lowest compression force thermal gap filler options. Sarcon GR-Sd is engineered to efficiently transfer heat from its source to a nearby heat sink in applications that require extremely low force on the component as well as a high adhesion characteristic. Features include:

• A thermal conductivity of 1.4 W/m°K.
• A low thermal resistance between 1.72 and 2.33 °Cin2/W.
• A gap filler pad available in 2.5 and 5.0mm thick sheets.

For more information visit www.fujipoly.com