Advanced Encapsulating

Thursday, September 24, 2009

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Silicone_die-bond_materials
Features of the silicone die-bond materials include methyl silicone based system which hardens by using a heat cured platinum catalyst.

Shin-Etsu Silicones of America (Akron, OH) (U.S. subsidiary of Shin-Etsu Chemical Co. Ltd., Japan) has completed research-and-development leading to the introduction of a diverse line of silicone die-bond materials that provide advanced encapsulating performance for high-brightness LEDs (HBLED). Features include:

Die encapsulation, die-attach adhesive and lens-type material.
Methyl silicone based system which hardens by using a heat cured platinum catalyst.
Comprised of 3 key products (KER-300-M2 / KER-3100-U2 / KER-3200-T1).

For more information visit www.shinetsusilicones.com

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BROUGHT TO YOU BY

Shin-Etsu Silicones of America Inc.
1150 Damar Street, Akron, OH 44305-1201

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Silicone die-bond materials

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