Molex Incorporated (Lisle, IL) has announced a new development in LED array holder technology with integral electrical, mechanical, and optical connectivity for optimal performance and to simplify design integration for lighting manufacturers. The new technology from Molex transfers the connectivity and ease of use features from the LED array metal or ceramic substrate to a separate plastic body substrate, allowing for improvements in thermal, optical and mechanical interconnect functionality. Featured advances include:
- Thermally isolated solder pads.
- An integral Molex Pico-EZmate header.
- Improved mechanical attach and optical reference features.
- A solder free electrical interface.
For more information visit www.molex.com.