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LED Array Plastic Interconnection Technology

Tue, 01/29/2013 - 3:45pm
PD&D Staff

 

Molex Incorporated (Lisle, IL) has announced a new development in LED array holder technology with integral electrical, mechanical, and optical connectivity for optimal performance and to simplify design integration for lighting manufacturers. Existing LED arrays represent a challenging compromise between the LED array metal printed circuit boards or ceramic substrates being small enough to minimize costs and deliver the optical performance required while also providing electrical, mechanical, and optical attach features to make them easier to use in a lighting system. The new technology from Molex transfers the connectivity and ease of use features from the LED array metal or ceramic substrate to a separate plastic body substrate, allowing for improvements in thermal, optical and mechanical interconnect functionality. Features include:

  • An array top side surface with multiple connection choices.
  • Thermally isolated solder pads.
  • An integral Molex Pico-EZmate header.
  • Improved mechanical attach and optical reference features.

For more information visit www.molex.com.

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