Balluff’s (Florence, KY) new generation of Distributed Modular I/O can be used in a cost effective way to replace standard slice I/O and distributed I/O solutions. Offering IP67 protection, the new generation of Distributed Modular I/O also features:

• Industry standard connectors, which many types of control data can be collected from.
• The vendor neutral standard IO-Link.
• A master block that can communicate with up to 4 slave devices and then send their combined data back to the controller over the CC-Link network.
• An industry-standard M12 port, creating an IP67 connection. 
• Daisy-chain connections.
• Trunk & drop network architectures for easier troubleshooting.  
• An intuitive push-button display that allows the user to view and set the station address.

For more information visit www.balluff.com or email balluff.canada@balluff.ca.