Product Releases

Balluff Introduces Distributed Modular I/O for CC-Link

Mon, 11/05/2012 - 11:31am
PD&D Staff


Balluff’s (Florence, KY) new generation of Distributed Modular I/O can be used in a cost effective way to replace standard slice I/O and distributed I/O solutions. Offering IP67 protection, the new generation of Distributed Modular I/O also features:

  • Industry standard connectors, which many types of control data can be collected from.
  • The vendor neutral standard IO-Link.
  • A master block that can communicate with up to 4 slave devices and then send their combined data back to the controller over the CC-Link network.
  • An industry-standard M12 port, creating an IP67 connection. 
  • Daisy-chain connections.
  • Trunk & drop network architectures for easier troubleshooting.  
  • An intuitive push-button display that allows the user to view and set the station address.

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