Nextreme Thermal Solutions (Durham, NC) has announced a new series of thin-film thermoelectric modules that offer higher cooling capacity, robust mechanical design, and source-matched heat flux density for easier integration into existing electronic systems. At only 1.1 mm high, the new eTEC MA8000 Series is designed to provide low-profile thermal management solutions for medium heat flux applications in markets including photonics, electronics, test and measurement, and aerospace. Features include:

  • 5 new modules that can pump from 10 to over 80 W of heat @ an ambient temperature of 25°C.
  • A footprint ranging from 63 to 375 mm².
  • Heat flux densities ranging from 16 to 22 W/cm².
  • A high-strength seal ring made from Cirlex polyimide film that provides mechanical isolation across the thermoelectric device.

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