This innovative technology from Molex enables numerous design configuration and material combination options, allowing medical device designers the flexibility to select plating and materials.

Molex Incorporated (Lisle, IL) has introduced its MediSpec Molded Interconnect Device (MID) capabilities utilizing Laser Directed Structuring (LDS) technology for high-density medical applications. This innovative technology:

• Delivers packaged interconnect solutions that meet or exceed stringent medical device guidelines.
• Helps medical device designers integrate complex electrical and mechanical features into highly compact applications.
• Integrates both electrical and mechanical design into a single molded device.
• Enables numerous design configuration and material combination options, allowing medical device designers the flexibility to select plating and materials.
• Can be imaged with a 3-axis laser on a variety of RoHS-compliant plastics with pattern modification. 

For more information visit www.molex.com.