Ablefill UF8807 encapsulant is a high-flow liquid underfill developed for chip scale packages. It provides high glass transition temperature and low coefficient of thermal expansion characteristics that help reduce thermal and mechanical stresses between chip scale packages and HDI substrates in multi-package module applications.

This encapsulant relies on moisture-resistant cyanate ester chemistry and boasts fast cure characteristics. It's designed to flow rapidly into gaps of 6 mil and greater to form a protective, electrically insulating polymer when cured.