FLO/PCB Version 2.2 offers many enhanced features designed to improve usability and tighten integration between electrical and mechanical design of PC boards. The software features automatic “Manhattan Distance” calculation and constraint management, allowing engineers to introduce 1st order signal integrity requirements early in the design process. This is when component placement and thermal performance scenarios are studied as a function of functional definition. The software integrates fully with Flopack for on-the-fly IC model generation based on standard package outlines and features annotation auto-sizing to enhance readability of functional block and component placement diagrams. Interconnects are displayed according to signal speed and quantity, allowing engineers to quickly create functional block diagrams and visually identify critical connections. The software supports IDF-defined placement keep-out regions to minimize rework often associated with placement of components in locations reserved for mechanical features, such as connectors, heat sinks, manufacturing attachments. FLO/PCB is designed to allow engineers to resolve component placement and thermal issues early in the design process. Combining functional, component placement, and thermal views of a design into one virtual model, the software offers users specialized menus for rapid creation of functional block diagrams. Additional features include rapid 3D airflow and temperature prediction for both sides of the board, the ability to automatically create physical layout and thermal models from a functional block diagram, and automatic report generation via HTML. A fully integrated library functionality supports JEDEC standards for component thermal models. The software can export/import board design information to and from EDA and CAD software via IDF file format and is compatible with WindowsXP, WindowsNT, and Windows2000 operating systems. FLO/PCB Version 2.2 also offers native, bi-directional interoperability with FLOTHERM.