The GIG-Array high-speed, high-density mezzanine connector line now includes connector configurations that provide 200 signal contacts at 15, 20, 25, 30, and 35 mm board spacing. The 200-position and 296-position connector sizes are available in the following stack heights: 15, 18, 20, 25, 28, 30, and 35 mm. The GIG-Array line is designed for 100-Ohm matched impedance to support differential signaling at data rates of 10 Gb/sec. The line, which is said to offer low crosstalk to preserve signal integrity, is well suited for high-speed board-stacking applications in server, storage, transmission, switching, and networking equipment. The 200-position connector includes 25 columns with eight individual signal contacts and 10 ground contacts in each column (a total of 200 signal and 250 ground contacts). Using individual contacts for both signal and ground connections instead of interleaving ground shields is said to provide more flexibility in handling power or low-speed, single-ended signals. All GIG-Array connectors feature Ball Grid Array (BGA) connector termination for easy attachment to PC boards using conventional reflow soldering processes. This 1 x 0.65 mm ball grid is designed to optimize routing and electrical performance.