EP21FL features a typical viscosity of Part A is 4,000 cps at 25ºC and 10,000 cps at 25ºC for Part B.
Master Bond (Hackensack, NJ) EP21FL is a two part epoxy resin system that features low to moderate viscosity. It is well suited for potting, coating and sealing electronic assemblies and excels at bonding dissimilar substrates with different coefficients of expansion. Features include:
A wide service temperature range of -60º to +250ºF.
A typical viscosity of Part A is 4,000 cps at 25ºC and 10,000 cps at 25ºC for Part B.
High strength castings, bonds and seals which are remarkably resistant to thermal cycling and shock.
A bond strength that is generally greater than 1,500 psi.
A tensile strength that normally exceeds 1,100 psi.
A hardened compound of electrical insulator with a volume resistivity greater than 1012 ohm-cm.
For more information visit www.masterbond.com
ADVERTISEMENT