A new family of advanced thermal interface materials has been designed for high-performance flip chip BGA packages. The Abletherm 3100 Series is formulated to offer high thermal performance, low modulus, and high adhesion – a combination that promises to provide heat transfer and device reliability unmatched by thermal greases, gels, and phase change materials.

The new materials have low moisture absorption capabilities, which contributes to their adhesion reliability during 200-hour HAST exposure. Additionally, their ultra-low stress bond between the chip and thermal lid survives 1,000 temperature cycles without delaminating. The adhesion properties of these materials also enable their use in FCBGA lid attach applications.

The 3100 Series also offers good dispensability and rheology, allowing the materials to be easily incorporated into standard dispensing processes.

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