The silicone compound features a thermal conductivity of 3.2 W/m°K.

Fujipoly’s (Carteret, NJ) SARCON SPG-30A is a newly developed high viscosity, thermal interface silicone compound that is designed to efficiently transfer heat from a board-level source to a heat sink or heat spreader. Features include:

• A thermal conductivity of 3.2 W/m°K.
• A new thermal management option for electronic devices.
• Near-zero compression force.
• Easy conformity to all component shapes and sizes. 
• No heat curing required.
• A temperature range of -40° to + 150°C.

For more information visit www.fujipoly.com