Fujipoly's Sarcon 50G-Hm gap filler pad features a thermal resistance of .16°Cin2/W at 72.5 PSI.
An important consideration among electronics manufacturers is the damage that can be done to a thermal gap filler pad during delicate assembly and re-work operations. To help alleviate this problem, Fujipoly (Carteret, NJ) announces the availability of Sarcon 50G-Hm. This high performance, low resistance gap filler pad features:
A low-tac top surface.
A unique, one-sided treatment that is less sticky than the opposing surface.
A thermal conductivity of 6.0 W/m°K.
A thermal resistance of .16°Cin2/W at 72.5 PSI.
A thickness of 0.5mm.
Flame retardant TIM is available in sheets up to 300 x 200mm.
For more information visit www.fujipoly.com.
ADVERTISEMENT