Product Design & Development

Fluid Flow And Heat Transfer Simulation Software

Tuesday, September 06, 2005

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Fluid Flow And Heat Transfer Simulation Software

CFdesign Version 8.0 fluid flow and heat transfer simulation software features enhanced simulation, visualization, and collaboration components. The software is said to offer advancements in MCAD interoperability, mesh generation, simulation scope, simulation speed, design review, and project collaboration. Its automated solution center includes intelligent solver selection and intelligent solution control functions to automatically select appropriate solvers from dozens of options and monitor and assess solution convergence during the numerical calculation phase. These functions also allow the software to determine when simulation results are complete and reliable. CFdesign Version 8.0 selects the most appropriate solver for the application based on aspect ratio of flow passages, the number of flow passages, and the overall length of the device. The software automatically adjusts the convergence controls and the time step size to generate the optimal solution. The software also automatically adjusts to accommodate both changing and stable solutions. To simplify access to flow-driven motion analysis functions, the software’s motion module incorporates process templates, a motion editing station, and kinematics preview window. Users can set up rotating and translating motion, sliding vane pump motion, nutating motion, orbital motion, and custom scenarios. Spring resistance and external driving analysis functions are designed to expand the scope of flow-driven applications. Thanks to its integrated intelligence capabilities, the software can automatically determine and modify the time step size for current flow conditions. Engineers can use the real-time mesh estimator to determine the computer memory requirements before they begin the simulation. Integrated intelligence also drives an automated part-by-part meshing process. The surface parts feature is well suited for thin, 2D surfaces typically found in component- and board-level electronics, sheet metal enclosures, and fan blades.


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