
Tra-Bond 2158 flexible heat-conductive epoxy is thermally conductive for staking transistors, diodes, resistors, and other heat-sensitive components to PC boards.
The two-part epoxy forms durable, high-impact bonds at room temperature, allowing for good heat transfer and electrical insulation. The product bonds to metals, steatite, alumina, ceramics, glass, plastics, and many other materials, especially for substrates with largely mismatched coefficients of thermal expansion, and offers good chemical resistance.
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