The 20-2121 is a 2 component, low viscosity, room temperature curing system.

Epoxies, Etc (Cranston, RI) has developed a new potting, encapsulating, and casting resin. The 20-2121 is a 2 component, low viscosity, room temperature curing system.  Features include:

• An easy-to-use polyurethane that will cushion and protect sensitive electronic components. 
• Very little stress imparted on components during cure or thermal cycling due to its low durometer.
• Low toxicity to reduce employee exposure to dangerous chemicals.
• Low viscosity for quick self leveling around components.
• Moisture resistance to ensure usability in wet environments.
• Low shrinkage and exotherm — will not damage components during cure.

For more information visit www.epoxies.com.