The IT3 Series features a three-piece modular design consisting of two low profile receptacles.

Hirose Electric (San Jose, CA) has developed the next generation of its high density board-to-board connector family.  Designated the IT3 Series Mezzanine Connector, the three-piece modular system provides easier assembly, reliable X-ray inspection, better reflow performance and higher production yield between two parallel PC boards, without sacrificing overall connector performance. The enhanced design features:

• A three-piece modular design consisting of two low profile receptacles.
• BGA solder balls mounted  in a staggered array of 1.5mm by 1.75mm pitch.  A floating Available in 100-, 200-, and 300-position modules, with interposers for board stack heights from 15mm to 40mm.
• Rated at 50 ohm single ended impedance and 100 ohm differential impedance.  Ag3.0- EIA-364-1000 qualified for environmental performance.
• IPC-9701 qualified for long-term solder joint reliability.