Engineers can mount components on flexible circuits with a component assembly on both prototypes and full production runs. A surface mount process can accommodate package sizes down to 0402 and 0.5 mm pitch leaded packages. Polyimide or epoxy-glass stiffeners can be laminated in place to provide additional support and strain relief. Specialties include high-reliability flex circuits for medical device, medical implant, diagnostic ultrasound, telecommunications, and patient monitoring applications. Flex circuits using both adhesive-based and adhesive-less raw materials are available.