Miniature UltraCool IV copper pin fin heat sinks provide cooling solutions for small sized devices and for applications in which the space available for cooling purposes is limited.
The line features a wide array of copper pin fin heat sinks that range from a footprint of 0.25 in. squared to 0.75 in. squared and from an overall height of 0.15 in. to 0.8 in.
The pin fin structure has an omnidirectional structure and a large surface area. The use of oxygen-free copper provides a conductivity premium of over 100 percent when compared to identically structured aluminum heat sinks. As a result, these miniature heat sinks are able to dissipate heavy loads that traditionally require the use of heat sinks of substantially larger size.
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