The low pressure sensor dies feature low gravity/vibration sensitivity.

All Sensors Corporation (Morgan Hill, CA) has announced the introduction of low pressure sensor die for high volume applications requiring pressure measurement to as low as a quarter inch of water full scale. Features include:

• Low pressure from 5 inch H2O to 30 inch H²O.
• High pressure sensitivity.
• Low gravity/vibration sensitivity.
• Reduced sensitivity to package induced stress.
• Die in wafer form with ≈ 3,000 die/6” wafer.
• Die metal suitable for aluminum or gold wire bond.
• Die backside suitable for RTV or epoxy die attach.
• Die surface suitable for parylene or silgel coating.

For more information visit www.allsensors.com