Express Manufacturing has introduced the Package on Package (PoP) assembly packaging technology to help design compact portable and desktop medical devices.

The PoP vertically stacks a discrete controller and memory Ball Grid Array (BGA) components. This allows Multi Chip Packages to be integrated for greater space savings on the PCB. Instead of occupying multiple flat surface areas on the PCB, this will allow the components to slack up much like a high-rise building.

By investing in PoP capable equipments, EMI has simplified the assembly process using a single flow/reflow which eliminates thermal stress during assembly. Furthermore, a dedicated assembly flow is designed based on the thermal coefficient characteristics of the components.

For more information visit www.eminc.com.