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Materials & Prototyping

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The latest products related to materials, prototyping, additive manufacturing, fabrication, composites and more.

Fast, Tack-Free Cure   11/20/2009
DYMAX Cure-Point 9440-A/B cures to depth in seconds upon exposure to UV/visible light to provide protection to electronic components and circuitry.   Continue
12 Channels Of 10 Gbps Data   11/17/2009
Molex Incorporated announces the iPass+ High-Speed Channel (HSC) pluggable CXP copper and optical interconnect system enabling 12 channels of 10 Gbps data, for up to 120 Gbps of total bandwidth.   Continue
Minimal Thermal Impedance   11/5/2009
Bergquist introduces a new high thermal performance dielectric into its comprehensive Thermal Clad metal core PCB line.   Continue
Natural Tack, Easy Dispensing   11/5/2009
The Bergquist Company announces the latest addition to its family of thermally conductive phase change materials, Hi-Flow 330P.   Continue
PTFE Technology   11/3/2009
W. L. Gore & Associates (Gore) has applied its award-winning PTFE technology to a family of hydrophobic filters for the manufacture of bulk high-purity chemicals used in semiconductor and electronics fabrication.   Continue
Reduced Static Noise   11/3/2009
Connectors Unlimited worked with custom compounder RTP Company to formulate and supply plastic materials when developing a shielding solution for their analog cable and circuit connectors.   Continue
Abrasion-Resistant Covers   10/30/2009
Eaton Corporation has announced that its Aeroquip MatchMate Global braided and spiral hydraulic hose products have been re-engineered to provide significantly higher working pressures and temperature ratings along with covers offering superior abrasion resistance.   Continue
Tool-Only Operation   10/29/2009
PennEngineering introduces the expanded family of PEM self-clinching captive panel screw products includes several UL-approved types designed specifically for tool-only operation.   Continue
Optically Clear   10/29/2009
Master Bond’s newly developed EP30LV-1 is a low viscosity, optically clear epoxy for general purpose bonding, coating, sealing and casting.   Continue
BAM Approval For Gaseous Oxygen   10/29/2009
Permabond Engineering Adhesives MH052 has BAM approval for use with gaseous oxygen up to 10 bar (145 psi) and 60°C (140°F).   Continue
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Don’t Bet On It
Karen Langhauser, Editor-in-chief, Food Manufacturing
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