With the ability to run on Windows, Linux, Solaris and Macintosh workstations with a minimum of 1 GB of memory, COMSOL Multiphysics 3.4 is highlighted by:

• Parallel meshing, assembly and solving on multicore and multiprocessor computers.
• Memory-efficient fluid flow solvers for chemical engineering, heat transfer and microfluidics.
• A segregated solver that minimizes memory consumption for large multiphysics problems.
• Improved post-processing including geometric properties.
• Easy modeling of electronics cooling and free convection with interfaces for variable-density flow.
• Boundary layer meshing to represent boundary layers in fluid flow, heat transfer and electromagnetics.
• Bubbly flow interfaces for modeling of scrubbers, aerators, bioreactors, food processing equipment and boiling.
• Mixture-model two-phase flow interfaces for simulation of emulsification, sedimentation and separation processes.
• Nonlinear parameter estimation.
• Piezoacoustic multiphysics modeling of microphones, ultrasonic transducers and MEMS devices.
• Full-wave 3-D RF analysis of PCBs and transmission lines with lumped port boundary conditions.
• Fatigue analysis.