CPS Technologies now offers AlSiC (Aluminum Silicon Carbide) metal matrix composite pin fin substrates for liquid-cooled high-power module systems. According to the company, the new offering features: ?Liquid cooling to dissipate heat (1 to 2 KW) in power module applications. ?An isotropic thermal expansion (8 PPM/°C) that is compatible with the thermal expansion of IGBT die and ceramic dielectric substrates to reduce mechanically induced stresses during thermal cycling.?A low thermal expansion.?An IGBT assembly, which eliminates the need for stress compensation layers, and increases thermal resistance and assembly complexity. ?A lightweight material which makes it an ideal cooler material for the weight-sensitive HEV application. ?A higher strength and stiffness than copper, which, combined with its lightweight nature, can make AlSiC coolers more tolerant to shock and vibration.?
marko@alsic.com?www.alsic.comADVERTISEMENT