MaxiFlow heat sinks are designed for cooling BGAs and other hot components in the restricted air flow conditions typical of today’s condensed electronic packages. The heat sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The heat sinks are fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight, and keeps costs low. Tests on MaxiFlow heat sinks using an air flow rate of just 100 lfm show that device junction temperatures can be reduced by more than 40 percent below the temperatures achieved using other heat sinks. The expected life span of an electronic component is exponentially dependent on temperature. Cooler parts have longer lives. Higher performance MaxiFlow heat sinks can help ensure reliable product life at a lower cost than custom designed solutions and other extruded sinks. Unit pricing for the heat sinks starts at $2.50 in production quantities.