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High Thermal Conductivity

Tuesday, February 24, 2009

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High Thermal Conductivity

Master Bond (Hackensack, NJ) has developed a new two part adhesive system called EP21AN with a thermal conductivity in excess of 22 (BTU•in/ft²•hr•°F). Features include:

EP21AN with a thermal conductivity in excess of 22.

Master Bond (Hackensack, NJ) has developed a new two part adhesive system called EP21AN with a thermal conductivity in excess of 22 (BTU•in/ft²•hr•°F). Features include:

  • Electrical insulator with a dielectric strength of >400 volts/mil.
  • Volume resistivity greater than 1013 ohm-cm.
  • Non-critical 1/1 mix ratio by weight or volume.
  • Availability in 1/2 pint, pint, quart, gallon and 5 gallon kits.

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