Product Design & Development

Fast-cure Epoxy Adhesive

Monday, September 24, 2001

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Fast-cure Epoxy Adhesive

Tra-Bond 2106T epoxy adhesive is formulated for lower-temperature or wet industrial bonding applications requiring fast curing.

The two-part thixotropic epoxy system contains no solvents, mixes easily at room temperature, and is suitable for high-performance structural bonding applications requiring fast room-temperature curing coupled with low shrinkage and good mechanical and electrical properties. The adhesive forms a strong bond to metals, plastics, glass, glass fabrics, ceramics, rubber, and other construction materials.


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