The compact and scalable Matrix Clip System heat sink can be expanded as desired to accommodate as many devices as needed. It can be universally mounted on PC or wiring boards with no need to change the airflow direction. It consists of a base frame with extruded, brazed, or bonded fins that provide large surface area (fin density up to 20 fins/in.) in a small space. Solderable feet and torsion spring clips hold devices to the heat sink with uniform pressure for high reliability and repeatability, shock and vibration resistance, minimum air drag, and light weight. Expansion is designed to be easy. The number of power devices can be increased transversally and longitudinally by adding spring clips along the x and y axes. Applications include electronic packaging with high power density, small size (1U or 2U), and forced convection cooling.

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