Endicott Interconnect Technologies expands with UK Office and appoints european sales director
 Steve Payne has been named director of European sales for EI Technologies UK Limited. |
Endicott Interconnect Technologies (EI) (Endicott, NY) announced that it has created EI Technologies UK Limited, a wholly owned subsidiary of EI and located in Chelmsford, UK.
Steve Payne has been named director of European sales, reporting to Michael Hills, SVP of Sales, Marketing and Business Development at EI, effective immediately.
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Payne will assume the role of managing the newly formed UK office, with EI’s European manufacturing representatives reporting to him. By leveraging EI’s innovative technology and production capabilities, Payne is also tasked with account penetration of segments targeted for future growth in the European marketplace.
With over 30 years experience in the global electronic packaging industry, Payne brings solid technical knowledge as well as a keen understanding of European business cultures, according to the company.
He is particularly skilled at identifying technical business opportunities and managing programs from inception to successful completion. Prior to joining EI, he was Divisional Manager at GEC Marconi Research and Managing Director of Cirflex Technology. Payne’s formal education includes Applied Physics from METC, now known as Anglian Ruskin University.
“We continue to expand and diversify our sales and support infrastructure in an effort to strengthen our focus on future growth opportunities and penetrate markets we do not currently serve,” comments Michael Hills. “Steve is a great addition to our team. He brings broad technical, management, business development and sales experience making him the ideal choice to drive our growing business in the UK.”
Payne resides in Chelmsford, UK with his wife and children.
About Endicott Interconnect Technologies
Endicott Interconnect Technologies is a supplier of electronic interconnect solutions consisting of fabrication and assembly of complex printed circuit boards, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration.
For more information about EI and its products, please visit www.endicottinterconnect.com.